technical specification of copper-based ccl
us bergquist substrate
items
technical index
product model
al substrate cu substrate
material model
domestic al imported al domestic cu imported cu
a1100 a5052 a6061 a6063 c1100
surface disposal
spray tin/ chemical tin/chemical gold/osp/ immersion tin
layers
single-side al substrate / double-side al substrate /four-layer al substrate
maximum measurement
1100mm*480mm
minimum measurement
5mm*5mm
line width/space
0.1mm
warp and twist
¡Ü0.5%(thickness:1.6mm, measurement:300mm¡Á300mm)
processing thickness
0.3£4.5mm
copper foil thickness
35um 70um 105um 140um
molding dimension tolerance
¡À0.15mm
v-cut positioning accuracy
¡À0.1mm
processing capability
6000m2
cu thickness of inner aperture
20-25um
aperture location deviation
¡À0.076mm
minimum diameter of piercing
lower than1.0mm 1.0mm
1.2-3.0mm 1.5mm
minimum specification of the square groove
plate thickness lower than1.0mm 0.8mm¡Á0.8mm
plate thickness 1.2-3.0mm 1.0¡Á1.0mm
circuit printing deviation
scope of molding dimension tolerance
cnc£º¡À0.1mm punching the shape£º¡À0.15mm
mini aperture
0.8mm not limited to the maximum aperture diameter
coating thickness
gold plating£ºni 2.5-5um au 0.05-0.1um 0.025£0.075um
immersion gold£ºni 5-8um au0.08-0.1um
spray tin 3-30um 4-30um
v£cut angle deviation
¡À5¡ã
scope of v-cut plates
0.6mm-3.2mm
marking font of the smallest component
0.15mm
smallest windowing of pad
0.01mm